Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO₂ nanoparticle addition

All authors contributed to the study conception and

design. Material preparation, data collection and

analysis were performed by Shunya Nitta. The first

draft of the manuscript was written by Shunya Nitta

and all authors commented on previous versions of

the manuscript. All authors read and approved the

final manuscript.

1. X. Li, H. Andersson, J. Sidén, T. Schön, Flex. Print. Electron. 3, 015003 (2018)

2. T. Aizawa, K. Okagawa, M. Kashani, J. Mater. Process.

Technol. 213, 1095 (2013)

3. M. Layani, S. Magdassi, J. Mater. Chem. 21, 15378 (2011)

4. V. Zardetto, T.M. Brown, A. Reale, A. Di Carlo, J. Polym.

Sci., Part B: Polym. Phys. 49, 638 (2011)

5. L. Sun, L. Zhang, Adv. Mater. Sci. Eng. 2015, e639028

(2015)

6. Y. Zhang, Z. Cai, J. C. Suhling, P. Lall, and M. J. Bozack,

in 2008 58th Electronic Components and Technology Conference (2008), pp. 99–112.

7. JIS Z 3282 (2017)

8. B.-S. Yim, J.I. Lee, Y. Heo, J. Kim, S.H. Lee, Y.-E. Shin,

J.-M. Kim, Mater. Trans. 53, 2104 (2012)

9. H. Kang, S.H. Rajendran, J.P. Jung, Metals 11, 364 (2021)

10. Y. Liu, K.N. Tu, Mater. Today Adv. 8, 100115 (2020)

11. D. Le Han, Y.-A. Shen, S. Jin, H. Nishikawa, J. Mater. Sci.

55, 10824 (2020)

12. F. Huo, Z. Jin, D. Le Han, K. Zhang, H. Nishikawa, Mater.

Des. 210, 110038 (2021)

13. S. Cai, X. Luo, J. Peng, Z. Yu, H. Zhou, N. Liu, X. Wang,

Adv. Compos. Hybrid Mater. 4, 379 (2021)

14. K. Kanlayasiri, M. Mongkolwongrojn, T. Ariga, J. Alloys

Compd. 485, 225 (2009)

15. W. Xing, X. Yu, H. Li, L. Ma, W. Zuo, P. Dong, W. Wang,

M. Ding, J. Alloy. Compd. 695, 574 (2017)

16. L. Yang, S. Quan, C. Liu, H. Xiong, J. Nanosci. Nanotechnol. 20, 2573 (2020)

17. S.H. Rajendran, S.J. Hwang, J.P. Jung, Metals 10, 1295

(2020)

18. J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, H.X. Gao, J. Electron. Mater. 35, 1672 (2006)

19. T. Takemoto, J. Japan Weld. Soc. 75, 583 (2006)

20. S. Amares, R. Durairaj, and S. H. Kuan, Arch. Metall.

Mater. 407 (2021).

21. F. Huo, Y.-A. Shen, S. He, K. Zhang, H. Nishikawa, Vacuum 191, 110370 (2021)

22. Y. Hirata, C. Yang, S. Lin, H. Nishikawa, Mater. Sci. Eng.,

A 813, 141131 (2021)

23. S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng, L.C. Tsao,

Mater. Des. 32, 4720 (2011)

24. C.D. Beachem, G.R. Yoder, Metall. Mater. Trans. B 4, 1145

(1973)

25. P.J. Noell, J.D. Carroll, B.L. Boyce, Acta Mater. 161, 83

(2018)

26. J.W. Morris, J.L.F. Goldstein, Z. Mei, JOM 45, 25 (1993)

Funding Open access funding provided by Osaka University.

The authors declare that no funds, grants, or other

support were received during the preparation of this

manuscript.

Data availability The datasets generated during and/or analyzed during

the current study are available from the corresponding

author on reasonable request.

Declarations Conflict of interest The authors have no relevant financial or non-financial interests to disclose.

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License,

which permits use, sharing, adaptation, distribution

and reproduction in any medium or format, as long

as you give appropriate credit to the original author(s)

and the source, provide a link to the Creative Commons licence, and indicate if changes were made.

The images or other third party material in this article are included in the article’s Creative Commons

licence, unless indicated otherwise in a credit line to

the material. If material is not included in the article’s

Creative Commons licence and your intended use is

not permitted by statutory regulation or exceeds the

permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of

this licence, visit http://creativecommons.org/licenses/

by/4.0/.

J Mater Sci: Mater Electron (2023) 34:2066 27. J. Wu, S. Xue, J. Wang, M. Wu, J. Alloys Compd. 784, 471

(2019)

28. S.H. Rajendran, H. Kang, J.P. Jung, J. Mater. Eng. Perform.

30, 3167 (2021)

29. J. Wu, S. Xue, J. Wang, J. Wang, S. Liu, J. Mater. Sci.

Mater. Electron. 28, 10230 (2017)

30. L.C. Tsao, S.Y. Chang, Mater. Des. 31, 990 (2010)

31. Y. Li, Z. Deng, Acc. Chem. Res. 52, 3442 (2019)

32. L.C. Tsao, C.H. Huang, C.H. Chung, R.S. Chen, Mater. Sci.

Eng. A 545, 194 (2012)

33. J. Shen, Y.C. Chan, Microelectron. Reliab. 49, 223 (2009)

34. V. Shepelevich and J. Wang, Inorg. Mater. 48, (2012).

35. J. Evans, A Guide to Lead-Free Solder: Physical Metallurgy

and Reliability (Springer, 2007).

Page 13 of 13 2066

36. D. L. Han, H. Tatsumi, F. Huo, and H. Nishikawa, in 2022

IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022), pp. 2148–2152.

37. Z. Lai, D. Ye, J. Mater. Sci. Mater. Electron. 27, 3182

(2016)

Publisher’s Note Springer Nature remains neutral with

regard to jurisdictional claims in published maps and

institutional affiliations.

...