Mass-Fabrication Scheme of Highly Sensitive Wireless Electrodeless MEMS QCM Biosensor with Antennas on Inner Walls of Microchannel

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Figure 1: (A) Illustration of the fabricated MEMS QCM biosensor chip and (B) its crosssection view. (C) Explanation of the three-layer structure of the chip.

Figure 2: (A) Illustration of the MEMS QCM functionalization process. (B) Schematic of

the QCM surface functionalized by SAM and protein A for IgG detection. (C) Frequency

responses of the 125-MHz MEMS QCM biosensor in IgG detection during the binding reaction.

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Figure 3: (A) Illustration of the cross-section of the ZZ-BNC. (B) Schematic of the QCM

surface functionalized by ZZ-BNC for IgG detection. (C) Frequency responses of the 125MHz MEMS QCM biosensor in IgG detection during the binding reaction. (D) Frequency

decreases measured by the 125-MHz MEMS QCM in IgG detection using protein A and

ZZ-BNC at 30 min. (E) Exponential coefficients of the frequency decrease curves in IgG

detection using protein A and ZZ-BNC as functions of the IgG concentration. The inset

shows the binding affinity between IgG and protein A and between IgG and ZZ-BNC.

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Figure 4: (A) Schematic of the QCM surface functionalized by ZZ-BNC and anti-CRP antibody for CRP detection. (B) Frequency responses of the 166-MHz MEMS QCM biosensor

in CRP detection during the binding reaction. (C) Frequency decreases at 10 min against

the logarithm of CRP concentration.

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For Table of Contents Only

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Mass-fabrication scheme of highly sensitive wireless

electrodeless MEMS QCM biosensor with antennas on inner

walls of microchannel

Lianjie Zhou,†,⊥ Fumihito Kato,‡,⊥ Masumi Iijima,¶ Tomoyuki Nonaka,§ Shun’ichi Kuroda,∥ and Hirotsugu Ogi∗,† †Graduate School of Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871, Japan ‡Department of Mechanical Engineering, Nippon Institute of Technology, Gakuendai 4-1, Miyashiro-machi, Minamisaitama, Saitama 345-8501, Japan ¶Department of Nutritional Science and Food Safety, Tokyo University of Agriculture, Sakuragaoka 1-1-1, Setagaya-ku, Tokyo 156-8502, Japan §Samco Inc., Waraya-cho 36, Takeda, Fushimi-ku, Kyoto 612-8443, Japan ∥The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 81, Ibaraki, Osaka 567-0047, Japan ⊥Contributed equally to this work *E-mail: ogi@prec.eng.osaka-u.ac.jp Supporting Figure S1

Supporting Figure S2

••••••••••••••••••••••••••••••

••••••••••••••••••••••••••••••

S-1

S-2

S-3

Figure S1

4-inch wafer-level MEMS process for fabricating ~180 ultra-high sensitive QCM

biosensors. This MEMS process consists of four processes: (i) Glass-wafer process for fabricating

upper and bottom glass wafers with microchannels and inner and outer antennas, (ii) silicon-oninsulator (SOI) wafer process for making the middle Si layer as the bonding layer, (iii) quartz-wafer

process for patterning the isolated thin quartz resonators, and (iv) packaging process.

S-2

Df/f0 (ppm)

IgG (1 ng/mL) GHB IgG (10 ng/mL)

GHB

IgG (100 ng/mL)

HBS

GHB

HBS

HBS

-50

HBS

HBS

-100

HBS

HBS

10

12

Time (hour)

Figure S2 Frequency response of a 125 MHz MEMS QCM in a long-term measurement of IgG

detection.

S-3

...